spec no: dsad1515 rev no: v.2 date: jan/05/2005 page: 1 of 4 approved: j. lu checked: joe lee drawn: y.cheng package dimensions & internal circuit diagram notes: 1. all dimensions are in millimeters (inches), tolerance is 0 .25(0.01")unless otherwise noted. 2. specifications are subject to change without notice . attention observe precautions for handling electrostatic discharge sensitive device s apdc04 - 41pwfa white description the source color devices are made with ingan on sic light emitting diode. static electricity and surge damage the leds. it is recommended to use a wrist band or anti - electrostatic glove when handling the leds. all devices, equipment and machinery must be electri- cally grounded. surface mount display features 0.4inch digit height. low current operation. excellent character appearance. i.c. compatible. mechanically rugged. standard : gray face, yellow fluorescent segment. package:500pcs/ reel.
spec no: dsad1515 rev no: v.2 date: jan/05/2005 page: 2 of 4 approved: j. lu checked: joe lee drawn: y.cheng selection guid e part no. dice lens type iv (ucd) @ 20ma min. typ. apdc04 - 41pwfa white (ingan) yellow fluorescent 18000 78000 common cathode, rt. hand decimal description electrical / optical characteristics at t a =25 c absolute maximum ratings at t a =25 c note: 1. 1/10 duty cycle, 0.1ms pulse width. parameter white units power dissipation 102 mw dc forward current 30 ma peak forward current [1] 160 ma reverse voltage 5 v operating/storage temperature - 40c to +85c symbol parameter device typ. max. units test conditions v f forward voltage white 3.65 4.2 v i f =20ma i r reverse current white 10 ua v r = 5v x white 0.33 y white 0.34 c capacitance white 65 pf v f =0v;f=1mhz chromaticity coordinates
spec no: dsad1515 rev no: v.2 date: jan/05/2005 page: 3 of 4 approved: j. lu checked: joe lee drawn: y.cheng white apdc04 - 41pwfa
spec no: dsad1515 rev no: v.2 date: jan/05/2005 page: 4 of 4 approved: j. lu checked: joe lee drawn: y.cheng apdc04 - 41pwfa smt reflow soldering instruction s number of reflow process shall be 2 times or less and cooling process to normal temperature is required between first and second soldering process. recommended soldering pattern (units : mm ) reel dimension tape specifications (units : mm )
|
